Next generation Intel Core Ultra mobile processors codenamed Meteor Lake represent our biggest shift in SoC architecture in 40 years. The disaggregated design combines separate compute, SoC, graphics, and I/O tiles on a single substrate using Foveros advanced 3D packaging technology. Join us as we talk to the architectures and engineers behind the project to understand how its 3D Performance Hybrid Architecture leverages new low-power E-cores located in the SoC tile, how we navigated the challenges of putting key components on separate tiles, how Intel 4 process technology and Foveros packaging come together to make Meteor Lake a reality, and how the processor’s CPU, GPU, and new NPU resources can be used to optimally execute an array of different AI workloads.

Hear from the engineers behind 13th Gen Intel Core processors codenamed Raptor Lake: https://intel.ly/3LoKZFl

Learn more about the latest Xeon W processors otherwise known as Sapphire Rapids:
https://intel.ly/3rja265

0:00 - Introduction
0:34 - 3D Performance Hybrid Architecture
6:30 - System on Chip (SoC)
16:01 - Intel 4 Process Technology & Foveros
26:30 - AI & Neural Processing Unit (NPU)
31:21 - Outro

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